High-Heat, Lead-Free Soldering in a Shorter Tunnel

Our revolutionary PowerOven-6 can provide low-, medium-, and high-volume manufacturers in a variety of PCB industries a reliable solution to the challenges posed by lead-free reflow soldering, including higher temperatures and a tighter process window resulting in a low margin for error.

They also offer a lower price tag than other options on the market, making them a great choice when factory floorspace and budgetary room are both at a premium. The key to this is a proprietary design that features high-mass heat sources combined with efficient thermal heat transfer capabilities, giving you the uniform heating and exceptional process stability that you’re looking for, even in the face of varying loads.